The 15th Beijing Conference and Exhibition on Instrumental Analysis

October 25,2013 From: ABC sources
  • \r\n The 15th Beijing Conference and Exhibition on Instrumental Analysis\r\n

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    \r\n BCEIA 2013\r\n

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    \r\n Sponsored by the China Association for Instrumental Analysis (CAIA), and approved by the Ministry of Science and Technology, PRC, the 15th Beijing Conference and Exhibition on Instrumental Analysis (BCEIA 2013) is going to take place at Beijing Exhibition Center (BEC) during October 23-26, 2013. \r\n

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    \r\n Aiming at promoting academic exchanges among the related scientists of various countries and trade cooperation between the concerned Chinese and foreign partners in Instrumental Analysis, Beijing Conference and Exhibition on Instrumental Analysis (BCEIA) has developed into the largest and most influential international academic conference and exhibition in this field in China. \r\n

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    \r\n Since from 1985, Beijing Conference and Exhibition on Instrumental Analysis (BCEIA) is held once every two years and has been successfully organized 14 times. BCEIA mainly includes the conference on instrumental analysis participated by domestic and overseas experts and scholars, international exhibitions on analytical instruments, life science instruments and other instruments and equipment as well as other high-level forums related to the development of instrumental analysis science. \r\n

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    \r\n VISITOR'S PROFILE:\r\n

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    \r\n The 15th Beijing Conference and Exhibition on Instrumental Analysis (BCEIA 2013) is going to invite various visitors from different parts of the world who are interested to take active participation in this event. Some of those visitors are the people from Overseas multinational enterprise, Hong Kong, Macau or Taiwan enterprise, China enterprise, Privately operated enterprise, Sino foreign joint venture, Purchasing, Design and Research Production, Sales and Marketing and Administration and Management. \r\n

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    \r\n EXHIBITOR'S PROFILE:\r\n

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    \r\n Exhibition Range of the 15th Beijing Conference and Exhibition on Instrumental Analysis (BCEIA 2013) :\r\n

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    \r\n  Metal Working Equipment like Machining center, Milling machine, EDM, Wire Cut Machine, Coordinate grinding machine, Grinding machine, CNC machine, Engraving machine, Drilling Machine, Sewing machine, Blending machine, Dieing machine, Forging machine, Hydraulic press machine, Shearing machine, Fast molding system, Manufacturing and Auxiliary Equipment like CAD or CAM or CAE system, Software, Hardware, Flexible machining system, Polishing machine, Marking machine, Clamping apparatus, Fixing and clamping system, Measurement apparatus, Grinding material, Cutting oil, Lubricant, Releasing agent, Ultrasonic cleaning machine, Compressor, Motor, Bearing, Oil tank, Material and Parts like Alloy, Mold steel, Metal sheet, Bar, Mold base and parts, Aluminium alloy, Granite electrode, Copper electrode, Mold plate, Hot runner, Mold pin and shaft, Ejector, Die head, Fastener, Spring, Grinding wheel, Electric balance, Electric microscope, Projector, 3 coordinate measurement machine, Hardness tester, and Laboratory apparatus, Fork truck, Hanger, Conveyor, Storage system, Dieing, Screw and spring, Fork truck, Hanger, Conveyor, Storage system, Packaging machinery and automatic production line, Food and drug packaging, Bag and box machine, Printing and packaging machine, Auto fill machine, Label, Bar code, Inkjet printer, Packaging material, Transport packaging, Injection molding machine, Hot runner, Blow molding, Extrusion molding, Heat forming, Ultrasonic welding machine, High frequency welding machine, Sealing and Cutting machine, Vacuum forming machine, Pad printer, Screen printer, Hot stamping, Heat transfer and label printer, Plastic plate printer, Roller printer, Tufting and trimming machine, Tube production line and more.\r\n

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    by: Nate

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